November 5, 2014
Exhibitor @ Pack Expo 2014
Epsteiners Cody Mandel, Andrea Velasquez, & Ed Curley, AIA, LEED AP BD+C are exhibiting at Pack Expo 2014, a tradeshow focused on processing and packaging solutions utilizing new technologies and ideas. Epsteins expertise in the design, engineering and construction of industrial processing facilities means that corporate engineers, plant managers, manufacturers and production supervisors from a variety of companies visit our booth to learn how we can help them provide flexible product production options for their customers.
The conference started this past Sunday and runs through today.
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